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NTGS3130N
Power MOSFET
20 V, 5.6 A Single
N-Channel, TSOP-6
Features
? Leading Edge Trench Technology for Low On Resistance
? Low Gate Charge for Fast Switching
? Small Size (3 x 2.75 mm) TSOP-6 Package
? This is a Pb-Free Device
Applications
? DC-DC Converters
? Lithium Ion Battery Applications
? Load/Power Switching
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
V (BR)DSS
20 V
http://onsemi.com
R DS(on) mAX
24 m W @ 4.5 V
32 m W @ 2.5 V
N-Channel
Drain 1 2 5 6
I D Max
5.6 A
4.9 A
Rating
Drain-to-Source Voltage
Symbol
V DSS
Value
20
Unit
V
Gate-to-Source Voltage
V GS
± 8
V
Gate 3
Continuous Drain Current
(Note 1)
Power Dissipation
(Note 1)
Continuous Drain Current
(Note 2)
Steady
State
t ≤ 10 s
Steady
State
t ≤ 10 s
Steady
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
I D
P D
I D
5.6
4.1
6.2
1.1
1.4
4.2
3.0
A
W
A
Source 4
MARKING DIAGRAM &
PIN ASSIGNMENT
Drain Drain Source
6 5 4
Power Dissipation
(Note 2)
Pulsed Drain Current
State
T A = 25 ° C
t P ≤ 10 s
P D
I DM
0.6
19
W
A
1
TSOP-6
CASE 318G
STYLE 1
S9 M G
G
Operating and Storage Temperature Range
T J , T stg
-55 to
150
° C
1 2 3
Drain Drain Gate
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
I S
T L
1.0
260
A
° C
S9
M
G
= Specific Device Code
= Date Code*
= Pb-Free Package
THERMAL RESISTANCE RATINGS
(Note: Microdot may be in either location)
Parameter
Symbol
Max
Unit
*Date Code orientation may vary depending
upon manufacturing location.
Junction-to-Ambient - Steady State (Note 1)
110
Junction-to-Ambient - t ≤ 10 s (Note 1)
Junction-to-Ambient - Steady State (Note 2)
R q JA
90
200
° C/W
ORDERING INFORMATION
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Device
NTGS3130NT1G
Package
TSOP-6
(Pb-Free)
Shipping ?
3000/Tape & Reel
1. Surface-mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces)
2. Surface-mounted on FR4 board using the minimum recommended pad size
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2007
May, 2007 - Rev. 0
1
Publication Order Number:
NTGS3130N/D
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